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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics


Author: G Q Zhang
Date: 15 Jan 2014
Publisher: Springer
Format: Paperback::208 pages
ISBN10: 1475731604
ISBN13: 9781475731606
File name: Benefiting-from-Thermal-and-Mechanical-Simulation-in-Micro-Electronics.pdf
Dimension: 170x 244x 11mm::340g

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Zhang Philips CFT, Eindhoven, The Netherlands L.J. Ernst Delft University of Technology, Delft, The Netherlands and o. De Saint Leger COMPETE Network Co-ordinator at MTA, Paris, France 'I Full text access Inside front cover - Editorial board Page IFC Download PDF; Special Section Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems (EuroSimE 2010) Fastest chip in terms of "flops per clock" is Intel Xeon with "core micro technology". Electromagnetic-Thermal Analysis Study Based on HFSS-ANSYS Link ANSYS Fluent, ANSYS CFX, ANSYS Mechanical Enterprise, ANSYS HFSS in order The new ANSYS Electronics Desktop interface introduced in ANSYS 16. Pdf Practice your memory skill with dynamic difficulty levels. 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